‹ vendredi 2 décembre 2022 | |
08:00
09:00
10:00
11:00
12:00
13:00
14:00
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›8:30 (30min)
The potential of 3D Plastronics: from packaging to ecofriendly innovative systems
Philippe Lombard - Ampere › Amphi E Chatelet, ENSMM
›9:00 (30min)
Heterogeneous integration on silicon nitride for integrated photonics: lasers and nonlinear materials
Maximilien Billet - Ghent University › Amphi E Chatelet, ENSMM
›9:30 (15min)
(supprimé) Frédéric Zamkotsian - LAM
MOEMS for space applications: Micromirror arrays for Universe and Earth Observation › Amphi E Chatelet, ENSMM
›9:45 (15min)
Jules Duraz - C2N
Fabrication and characterization techniques to study flexible micro light-emitting diodes with a millimetric radius of curvature › Amphi E Chatelet, ENSMM
›10:30 (30min)
Flexiboard: CMOS-MEMS chiplet integration with soft materials towards autonomous programmable matter
Yoshio Mita - UTokyo, LIMMS › Amphi E Chatelet, ENSMM
›11:00 (30min)
› Amphi E Chatelet, ENSMM
›11:30 (15min)
Anne-Claire Eiler - UTokyo
Design and fabrication of an SOI-CMOS large-scale integrated circuit for bioelectrochemical sensing › Amphi E Chatelet, ENSMM
›11:45 (15min)
Alain Bosseboeuf - C2N
Activation and gas sorption of Y-based getter films for wafer-level vacuum packaging of microsensors › Amphi E Chatelet, ENSMM
›12:00 (30min)
2D materials by chemical vapor deposition: from coupons to large area depositions
Vincent Astié - Annealsys › Amphi E Chatelet, ENSMM
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