Micro-nanotechnology school > Micro-nanotechnology school

Before the JNTE conference,the Micro-nanotechnologie School (2 days, courses and practical works in cleanroom, given by engineers and scientists experts in the field) for technicians, engineers, PhD students, researchers, etc. will be organized to share our knowledge in chemistry, materials science, microfabrication, physics in order to support multidisciplinary approaches in device development and to present and to practice different methods of microfabrication and heterogeneous integration.

 

SCHOOL PROGRAM

  • 9 hours of lectures (principles of different methods of integration and micro- and nanostructuring, reflections and exchanges between participants and lecturers):
     
    • Introduction to the clean room environment
    • Lithography I (UV lithography, direct writing, masks)
    • Lithography II (two photon lithography)
    • Wet etching and RIE
    • Microstructuring of glass (wet and dry etching, direct and assisted femtosecond laser processing, micromolding)
    • Polishing and surface quality
    • Wafer bonding (activation of surface, molecular bonding, anodic bonding and thermocompression)
    • Growth of thin films (adhesion, crystallisation, control of orientation and grain size, stresses)
    • Characterization of DC electrical (transport, resistivity, instrumentation, ohmic contacts) and optical properties
    • (Optional) Ellipsometry (advanced level)
       
       
  • 8 hours demonstrations-workshops in sub-groups will take place in a clean room, MIMENTO technology center (Renatech network) of FEMTO-ST.: participants will have the choice of four demonstrations (2 hours / workshop) among the six proposed (3 people maximum per workshop for the effectiveness of the training and the exchanges):
    1. Lithography/direct writing
    2. Microfabrication by two photon lithography (Nanoscribe)
    3. RIE structuring
    4. Wafer bonding and glass structuration by femtosecond laser assisted wet etching (FEMTO print)
    5. Thin film growth by PVD and CVD and stresses
    6. Imaging - Ellipsometry
       
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